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  this is information on a product in full production. february 2015 docid023772 rev 4 1/13 stptic parascan? tunable integrated capacitor datasheet - production data features ? high power capability (+36 dbm) ? high tuning range (3.5/1) ? high quality factor (q) ? high linearity device ? low leakage current ? capacitor bias is dc blocked ? frequency of operation from dc to 3 ghz ? 8 values available: 1.2 pf, 2.7 pf, 3.3 pf, 3.9 pf, 4.7 pf, 5.6 pf, 6.8 pf and 8.2 pf ? analog control voltage ? compatible with high voltage control ic (sthvdac series) ? available in plastic molded package: ? qfn package 1.2 x 1.6 x 0.9 mm ? flip chip 0.65 x 1.0 x 0.3 mm ? flip chip 0.65 x 1.2 x 0.3 mm ? ecopack ? 2 compliant component benefit ? rf tunable passive implementation in mobile phones to optimize antenna radiated performances. applications ? cellular antenna open loop tunable matching network in multi-band gsm/wcdma/lte mobile phone ? open loop tunable rf filters description the st integrated tunable capacitor, offers excellent rf performance, low power consumption and high linearity required in adaptive rf tuning applications. the fundamental building block of ptic is a tunable material called parascan, which is a version of barium strontium titanate (bst) developed by paratek microwave. bst capacitances are tunable capacitances intended for use in mobile phone application, and dedicated to rf tunable applications. these tunable capacitances are controlled through a bias voltage ranging from 2 to 20 v. the use of bst tunable capacitance in mobile phones enables significant improvement in terms of radiated performances making the performance almost insensitive to the external environment. tm: parascan is a trade mark of paratek microwave inc. stptic stptic qfn flip chip www.st.com
functional characteristics stptic 2/13 docid023772 rev 4 1 functional characteristics figure 1. ptic functional block diagram table 1. signal descriptions ball/pad number pin name description a1 dc bias dc bias voltage b1 rf2 rf input / output c1 rf2 rf input / output a2 nc not connected b2 rf1 rf input / output c2 rf1 rf input / output dc bias c1 a1 b1 b2 c2 a2 nc rf1 rf2 rf1 rf2
docid023772 rev 4 3/13 stptic electrical characteristics 13 2 electrical characteristics table 2. absolute maximum ratings (limiting values) symbol parameter rating unit p in input peak power rf in (cw mode)/all rf ports +36 dbm v esd(hbm) human body model, jesd22-a114-b, all i/o stptic-12 500 v stptic-27 400 (1) 1. currently failing around 400 v, improvement on going to withstand 500 v on 2p7 and 3p3. stptic-33 400 (1) stptic-39 500 stptic-47 500 stptic-56 500 stptic-68 500 stptic-82 500 v esd(mm) machine model, jesd22-a114-b, all i/o 100 v t device device temperature +125 c t stg storage temperature -55 to +150 v x bias voltage 25 v table 3. recommended operating conditions symbol parameter rating unit min. typ. max. p in rf input power (50% duty cycle mode) rf in (lb) rf in (hb) +35 +33 dbm f op operating frequency 700 3000 mhz t device device temperature +100 c t op operating temperature -30 +85 v x bias voltage 2 20 v
electrical characteristics stptic 4/13 docid023772 rev 4 table 4. representative performances (t amb = 25 c) symbol parameter conditions value unit min typ max c 2v capacitance at 2v bias stptic-12 1.08 1.20 1.32 pf stptic-27 2.43 2.7 2.97 pf stptic-33 2.97 3.3 3.63 pf stptic-39 3.51 3.9 4.29 pf stptic-47 4.23 4.7 5.17 pf stptic-56 5.04 5.6 6.16 pf stptic-68 6.12 6.8 7.48 pf stptic-82 7.38 8.2 9.02 i l leakage current measured with v bias = 20 v 100 na c tuning range ratio between c 2v /c 20v measured at 100 khz 3/1 3.5/1 q lb quality factor measured at 900 mhz 65 q hb quality factor measured at 1800 mhz 45 ip3 third order intercept point v bias = 2 v (1) and (3) 1. f 1 = 894 mhz, f 2 = 849 mhz, p 1 = 20 dbm, p 2 = -15 dbm, 2f 1 - f 2 = 939 mhz 60 dbm v bias = 20 v (1) and (3) 70 dbm h2 second harmonic v bias = 2 v (2) and (3) 2. 894 mhz, p in = 34 dbm -65 dbm v bias = 20 v (2) and (3) -65 dbm h3 third harmonic v bias = 2 v (2) and (3) -45 dbm v bias = 20 v (2) and (3) 3. ip3 and harmonics are measured in the shunt/series configuration in a 50 environment -45 dbm t t transition time from c min to c max (4) 4. one or both of rf in and rf out must be connected to dc ground 135 s from c max to c min (4) 100 s
docid023772 rev 4 5/13 stptic package information 13 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 2. qfn-6l package dimension figure 3. recommended pcb land pattern for qfn-6l package c 2 c 1 c2 a2 b2 b1 c1 a1 27 1.2 mm 0.05 mm 0.7 mm 0.425 mm 0.35 mm 0.03 mm 1.6 mm 0.05 mm 0.9 mm 0.1 mm 0.25 mm 0.03 mm 0.5 mm 550 m 600 m 300 m top metal nc rf1 rf1 bias nc rf2 solder mask opening rf1 rf2 rf1 250 m 300 m 200 m
package information stptic 6/13 docid023772 rev 4 figure 4. flip chip dimensions (size for 1p5) figure 5. flip chip dimensions (size for 2p7, 3p3, 3p9, and 4p7) figure 6. flip chip dimensions (size for 5p6, 6p8, 8p2) 400 m 190 m 190 m 440 m 110 m 110 m ubm pads 160 x 100 m 300 40 m 780 30 m 660 30 m 200 20 m 500m 360m 140m 440 m 105 m 105 m ubm pads 160 x 100 m 290 30 m 1000 30 m 650 30 m 200 20 m 350 m 350 m 360 m 140 m 440 m 105 m 105 m ubm pads 160 x 100 m 290 30 m 1200 30 m 650 30 m 200 20 m
docid023772 rev 4 7/13 stptic package information 13 figure 7. recommended pcb land pattern for flip chip package (metal defined pads, solder mask 25 m larger) figure 8. recommended pcb land pattern for flip chip ptic (die size 650 x 1200) 170 m 225 m 260 m 250 x 230 m 250 x 500 m 200 x 180 m 200 x 750 m solder mask metal defined pads solder mask metal defined pads ptic die size 650 x 1200 m 250 x 230 m 250 x 800 m
package information stptic 8/13 docid023772 rev 4 figure 9. qfn-6l tape and reel specification figure 10. flip chip tape and reel specification dot identifying b ump a1 location user direction of unreeling typical dimensions in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 1.05 1.45 0.25 1.85 27 27 27 user direction of unreeling typical dimensions in mm a0 = 1.12 mm for 2n7, 3p3, 3p9, and 4p7 a0 = 1.32 mm for 5p6, 6p8, and 8p2 4.0 2.0 a1 location 8.0 a0 2.0 1.75 3.5 ? 1.55 0.36 0.76 0.25
docid023772 rev 4 9/13 stptic package information 13 figure 11. qfn marking figure 12. flip chip marking (bump side view) 27 a b c 21 die die identifier on bump side
reflow profile stptic 10/13 docid023772 rev 4 4 reflow profile figure 13. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max) table 5. recommended values for soldering reflow profile value typical max. temperature gradient in preheat (t = 70-180 c) 0.9 c/s 3 c/s temperature gradient (t = 200-225 c) 2 c/s 3 c/s peak temperature in reflow 240-245 c 260 c time above 220 c 60 s 90 s temperature gradient in cooling -2 to -3 c/s -6 c/s time from 50 to 220 c 160 to 220 s
docid023772 rev 4 11/13 stptic ordering information 13 5 ordering information figure 14. ordering information scheme table 6. ordering information part number marking weight base qty delivery mode STPTIC-12F1M6 12 4.8 mg 3000 tape and reel stptic-27f1m6 27 4.8 mg 3000 tape and reel stptic-33f1m6 33 4.8 mg 3000 tape and reel stptic-39f1m6 39 4.8 mg 3000 tape and reel stptic-47f1m6 47 4.8 mg 3000 tape and reel stptic-56f1m6 56 4.8 mg 3000 tape and reel stptic-68f1m6 68 4.8 mg 3000 tape and reel stptic-82f1m6 82 4.8 mg 3000 tape and reel stptic-12g1h5 tbd 0.7 mg 15000 tape and reel stptic-27g1h5 i1x 0.7 mg 15000 tape and reel stptic-33g1h5 i3x 0.7 mg 15000 tape and reel stptic-39g1h5 i2x 0.7 mg 15000 tape and reel stptic-47g1h5 i5x 0.7 mg 15000 tape and reel stptic-56g1h5 i4x 0.7 mg 15000 tape and reel stptic-68g1h5 i7x 0.7 mg 15000 tape and reel stptic-82g1h5 i6x 0.7 mg 15000 tape and reel st ptic - 27 f 1 m6 stmicroelectronics parascan tunable integrated capacitor capacitor value design version package tolerance 27 = 2.7 pf m6 = qfn-6l h5 = flip chip 1 = 10%
revision history stptic 12/13 docid023772 rev 4 6 revision history table 7. document revision history date revision changes 02-nov-2012 1 initial release. 03-jul-2013 2 removed 6-pad 650 x 1000 flip-chip package. 10-jan-2014 3 updated : features , table 2 , table 4 , table 6 and added new figure 4 . 13-feb-2014 4 updated applications .
docid023772 rev 4 13/13 stptic 13 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved


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